Capability	(Rigid)	(AL,CU)
Minimum Trace/Space	3/3 mils	3/3 mils
Minimum Drilled Hole size	0.3 mm	N.A
Maximum Aspect Ratio	8:1	N.A
Minimum Board Thickness - 4 Layer	16 mils	N.A
Minimum Board Thickness - 6 Layer	32 mils	N.A
Maximum PCB Thickness	3.2 mm	3.6 mm
Minimum/Maximum Layer	2 to 16	2
Minimum SMT Device Pitch	12 mils	12 mils
Minimum SMT Device Land Width	8 mils	8 mils
Board Flatness Tolerance +/-	0.75%	N.A
Layer to Layer Reg. Tolerance +/-	4 mils	4 mils
Impedance Tolerance +/-	+/- 10%	N.A
Entek / Gold Plated / Tin	Yes	N.A
Blind / Buried via & plugged	Yes	N.A
Board Size	36” / 48”	340mm / 520mm

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