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鴻益科技有限公司
HON-YI TECHNOLOGYCO., LTD 
聯絡人:高鴻麒.萬麗君
電 話:(02)8684-6838
傳 真:(02) 8685-1161
手 機:0932-232-634
E-mail:[email protected]
業務部:[email protected]
地址:238 新北市樹林區中山路二段151巷15弄18號

 

 

Capability (Rigid) (AL,CU)
Minimum Trace/Space 3/3 mils 3/3 mils
Minimum Drilled Hole size 0.3 mm N.A
Maximum Aspect Ratio 8:1 N.A
Minimum Board Thickness - 4 Layer 16 mils N.A
Minimum Board Thickness - 6 Layer 32 mils N.A
Maximum PCB Thickness 3.2 mm 3.6 mm
Minimum/Maximum Layer 2 to 16 2
Minimum SMT Device Pitch 12 mils 12 mils
Minimum SMT Device Land Width 8 mils 8 mils
Board Flatness Tolerance +/- 0.75% N.A
Layer to Layer Reg. Tolerance +/- 4 mils 4 mils
Impedance Tolerance +/- +/- 10% N.A
Entek / Gold Plated / Tin Yes N.A
Blind / Buried via & plugged Yes N.A
Board Size 36” / 48” 340mm / 520mm







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鴻益科技有限公司 HON YI TECHNOLOGYCO., LTD
.聯絡人:高鴻麒.萬麗君 .電話:(02) 8684-6838
.傳 真:(02) 8685-1161.手 機:0932-232-634.E-mail:[email protected].業務部:[email protected]
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